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An established MIM alloy, Kovar is widely used in electronics
and optoelectronic applications for hermetically sealed packages. Its thermal
expansion characteristics match those of borosilicate glass enabling its use
for metal-glass or metal-ceramic interfaces.
| Physical Properties | |
| Density | > 8.36 g/cm³ |
| Melting Point |
1,450°C |
| CTE (20-400°C) | 4.5 ppm/°C |
| Mechanical Properties | |
| Ultimate Tensile Strength | 
450 MPa |
| Yield Strength |
|
| Elongation |
|
| Hardness |
110-140 HV1 |
| Analysis | |
| Fe | Balance |
| Ni | 28.5-29.5% |
| Co | 16.5-17.5% |
Data provided is typical. Actual parts should be tested for application specific performance.